Dec 16 2010
The International Bionic Engineering Conference 2011 organised by Elsevier, the leading publisher of scientific, technical and medical information products and services, aims to bridge the gap between academic research and industrial development in a field that is rapidly growing and gaining recognition across many disciplines.
Intended as a common ground for the exchange of ideas, Elsevier is calling upon key researchers in industry and academia from around the globe to engage each other with presentation and in conversation that inspires bionic solutions to some of the major engineering problems facing industry today. Topics include (but not limited to): understanding of materials in biomimetics; environmental aspects of biomimetics; sensors and signal processing; bio-inspired materials and self-x-mechanisms; impact on engineering; sustainability and responsibility; robotics, motion systems and artificial intelligence; medicine (prosthetics and orthotics).
Dr. Angela Welch, Elsevier Publisher commented, "We're excited by this opportunity to build on the successes of the previous Bionic Engineering conferences organized by the Key Laboratory for Terrain-Machine Bionic Engineering (China), and bring this unique event to a new geographic region supporting advances in biologically-inspired solutions to a wide range of real world challenges."
Professor Julian Vincent, the Conference Chairman and Professor of Biomimetics at the University of Bath added, "Bionic Engineering is a growing field. I believe it's very important to nurture this growth by holding meetings like this one. It will serve as an excellent platform for scientists to showcase their newest findings and interact directly with peers and leaders in the field."
This newest International Bionic Engineering conference is held in collaboration with the Journal of Bionic Engineering and set to take place from 18th to 20th September, 2011 at Boston's Westin Boston Waterfront Hotel. Further information can be found at www.bionicengineeringconference.com.
Source: Elsevier