ZEISS presents a new generation of focused ion beam scanning electron microscopes (FIB-SEMs) for high-end applications in research and industry. ZEISS Crossbeam 550 features a significant increase in resolution for imaging and material characterization and a speed gain in sample preparation.
Nanostructures such as composites, metals, biomaterials or semiconductors can be investigated with analytical and imaging methods in parallel. ZEISS Crossbeam 550 allows simultaneous modification and monitoring of samples, resulting in fast sample preparation and high throughput e.g. for cross-sectioning, TEM lamella preparation or nano-patterning.
ZEISS Crossbeam 550 provides best image quality in 2D and 3D. The new Tandem decel mode enables enhanced resolution together with a maximization of image contrast at low landing energies. The pioneering Gemini II electron optics delivers optimum resolution at low voltage and high probe current simultaneously.
The FIB column combines the highest available FIB current of 100 nA with the new FastMill mode, allowing for highly precise and more efficient material processing and imaging in parallel. Additionally, the new process for automated emission recovery increases the user-friendliness and optimizes the FIB column for reproducible results during long-term experiments.
Material scientists profit from excellent 3D analytical properties, especially thanks to the also new, fully integrated module for 3D EDS analyses with ZEISS Atlas 5. In the life sciences, ZEISS Crossbeam 550 convinces with its enhanced resolution at low voltages and an outstanding stability for long-term 3D tomography. Moreover, it is possible to optimally integrate the new workstation into correlative workflows and to combine it with light, X-ray or ion beam microscopy.
Microscope cameras with CMOS sensor and high acquisition speed released by Zeiss